| abstract |
The present invention discloses a technique for testing a packaged or unpackaged IC device, which device is aligned and disposed on an adhesive layer of an anisotropic conductive medium (ACM). The tacky ACM layer provides the necessary electrical contact for the IC device during testing, and also preserves the alignment of the IC device during movement between stations. Upon completion of the electrical testing of the IC device, the IC device package is lifted free from the adhesive layer and permanently bonded to the interconnect substrate. In one embodiment, the test interconnect substrate is a replica of the permanent interconnect substrate. In another embodiment of the invention, the test interconnect substrate is a substantially permanent interconnect substrate, in which case the IC device is bonded in place after the electrical test. |