abstract |
SUMMARY OF THE INVENTION An object of the present invention is to provide a method of forming a bump, a semiconductor device and a method of manufacturing the same, a circuit board and an electronic device, which can easily form a bump in a desired width, and as a means therefor, An opening 16 for exposing at least a portion of the pad 12 is formed in the insulating film 15, and a bump for connecting the pad 12 is formed. A resist layer 20 having a through hole 22 overlapping is formed, and an opening 16 is formed in the insulating film 15, and the metal layer is connected to the pad 12 exposed by the opening 16. To form.n n n n Pad, opening, insulating film, through hole, resist layer |