| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3263 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-5013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-095 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00 |
| filingDate |
1998-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100582799-B1 |
| titleOfInvention |
Resist film removing composition and method for manufacturing thin film circuit element using the composition |
| abstract |
Provided is a resist film peeling composition which is used in the manufacture of a thin film circuit element containing an organic insulating film and which can easily remove the resist film remaining after the etching treatment without swelling the organic insulating film. The resist film peeling composition comprises 50 to 90% by weight of alkanolamine having 3 or more carbon atoms, 8 to 40% by weight of water miscible solvent, and 2 to 30% by weight of water. |
| priorityDate |
1997-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |