| abstract |
An object of the present invention is to provide a method for producing conductive fine particles which can form a plating layer having a uniform thickness on all fine particles without aggregation of fine particles in a plating solution.n n n The present invention is a disk-shaped bottom plate fixed to the upper end of the vertical drive shaft; A porous body disposed on an outer circumferential upper surface of the bottom plate and configured to pass only a plating liquid; A contact ring for electricity disposed on the upper surface of the porous body; A hollow cover joined to a top end of a cone trapezoidal cover having an opening in an upper center thereof, the hollow park having a hole diameter equal to the opening diameter, and having an upper end folded back to the inner wall side of the hollow park; A rotatable processing chamber formed by sandwiching the porous body and the contact ring between an outer circumferential portion of the hollow cover and the bottom plate; A supply pipe for supplying a plating liquid from the opening to the processing chamber; A container receiving the plating liquid scattered from the hole of the porous body; A discharge pipe for discharging the plating liquid accumulated in the container; And an electrode inserted into the opening and contacting the plating liquid.n n n n Conductive fine particles, anisotropic conductive adhesive, conductive connecting structure, electronic circuit parts |