| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2519-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85909
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-20753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-0726
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-0775
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07779
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07749
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G08B13-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate |
1997-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100543349-B1 |
| titleOfInvention |
How to Wire Bond Integrated Circuits on Super Flexible Boards |
| abstract |
The present invention relates to a method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate. The flexible dielectric substrate has an IC attachment region and at least one resonant circuit formed thereon. The resonant circuit is formed of a first conductive pattern disposed on the first major surface of the flexible substrate and a second conductive pattern disposed on the second major surface opposite the flexible substrate. The first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, and the inductor also functions as an antenna. The IC attachment area of the flexible substrate is cleaned and the flexible substrate is fixed in a fixed position of the plenum to prevent substantial movement. The IC is fixed to the IC attachment area of the flexible substrate to minimize the movement of the IC relative to the flexible substrate. When the IC is wire bonded to at least one electrical conductor of the resonant circuit, the IC is electrically connected to the at least one electrical conductor. Protective coverings are applied over the IC and wire bond to protect the wire bond from damage by external forces. |
| priorityDate |
1996-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |