| abstract |
Disclosed is a highly reliable semiconductor chip electrode structure capable of controlling the interfacial reaction of a junction even using a conventionally used binary or ternary solder. A solder alloy layer is thinly formed on the UBM layer to prevent the tin from melting or diffusing into the tin-based lead-free solder. Tin solder is supplied in the form of solder paste or solder balls. A composite solder alloy layer, which is composed of an intermetallic compound of tin and a solder alloy layer and a intermetallic compound of tin and a UBM layer, is formed by heating and melting.n n n n Solder, Semiconductor Chip, Semiconductor Device, Solder Ball, Solder Bump, Solder Paste |