http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100536094-B1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L91-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
filingDate 2002-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2005-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100536094-B1
titleOfInvention Epoxy resin composition for encapsulation of semiconductor device
abstract The present invention relates to an epoxy resin composition for sealing semiconductor devices, and more particularly, to a mixture of an epoxy resin, a curing agent, a flame retardant mixture, a mixture of a phosphazene compound having a specific structure and a phosphate compound having a specific structure, a zinc borate inorganic flame retardant aid, a curing accelerator, The present invention relates to an epoxy resin composition for sealing semiconductor devices containing a modified silicone oil and an inorganic filler.n n n In the case of the epoxy resin composition according to the present invention, when used in a resin for sealing a semiconductor device using a non-halogen flame retardant without using a halogen flame retardant that is harmful to a human body and a device, it is not only excellent in flame resistance. , Excellent moldability and reliability.
priorityDate 2002-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 43.