| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-60 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242 |
| filingDate |
1998-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100530431-B1 |
| titleOfInvention |
Process for forming a semiconductor device |
| abstract |
The metal-semiconductor layer 26 is formed on the insulating layer 20, and the metal-semiconductor layer 26 is layered to have varying amounts of semiconductor and metal over the layer. In one embodiment, metal-semiconductor layer 26 has a relatively high silicon content near the bottom and top surfaces of the layer. At the midpoint, the layer is close to stoichiometric tungsten silicide. In another embodiment, a metal-semiconductor-nitrogen layer is formed that includes nitrogen near the bottom surface and is substantially free of nitrogen near the top surface. Layer 26 may be formed using chemical vapor deposition or sputtering. |
| priorityDate |
1997-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |