http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100529257-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2002-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2005-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100529257-B1 |
| titleOfInvention | Epoxy Resin Composition for Packaging Semiconductor Device |
| abstract | The present invention relates to an epoxy resin composition for sealing a semiconductor device, and more particularly, a diglycidyl ether bisphenol-modified epoxy resin and an isocyanate terminated polyurethane prepolymer, and a thermal shock, particularly a semiconductor, by high filling of an inorganic filler. Maintain high reliability by improving crack problems on the pad surface and chip and reducing adhesion problems between the epoxy encapsulant and the wafer chip in the high temperature solder process generated during lead-free in the post process. It relates to an epoxy resin composition for sealing semiconductor elements. |
| priorityDate | 2002-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.