| abstract |
The composition for forming a dielectric according to the present invention includes (A) a composite particle for dielectric having a conductive metal or a compound thereof, a conductive organic compound or a conductive inorganic material coated on a part or the entire surface of an inorganic particle having a dielectric constant of 30 or more, and (B) It is characterized by comprising a resin component comprising at least one of a polymerizable compound and a polymer.n n n In addition, another dielectric-forming composition according to the present invention contains (J) an inorganic ultrafine particle having an average particle diameter of 0.1 μm or less, and a resin component containing at least one of (B) a polymerizable compound and a polymer, wherein the inorganic ultrafine particle (J ) The ultrafine particle composite resin particles containing 20% by weight or more of the inorganic ultrafine particle (J) coated with the resin component (B) on part or the whole of the surface thereof, and having an average particle diameter of 0.1 to 2 µm and a dielectric constant of 30 or more. An inorganic particle or the inorganic composite particle which attached the conductive metal or its compound, the conductive organic compound, or the conductive inorganic substance to one part or whole part of the surface of this inorganic particle is characterized by the above-mentioned. |