| abstract |
This invention provides the ceramic electronic component 20 which has the surface conductor film 23 and the side conductor film 24 excellent in plastic shrinkage property, adhesive strength, weld heat resistance, weld water solubility, etc.n n n In the method for producing a ceramic electronic component of the present invention, Ag-based metal powder is contained as a main component, and the surface of the metal powder is any one selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. Conductor films 23, 24, and 25 are formed on the ceramic substrate 21 by using a conductor paste coated with an organic metal compound or metal oxide as a component. The side conductor film formation paste used here is (1). The coating amount of this organometallic compound or metal oxide is relatively small, and / or (2). It differs from the paste used for surface conductor film formation by either containing at least 1 type of inorganic oxide powder as a subcomponent, or having a relatively high content rate of this inorganic oxide powder. |