| abstract |
In some embodiments, the circuit structure includes a semiconductor substrate 110, an opening 130 passing through the substrate between the first side and the second side 110B of the substrate, and a plurality of conductive layers 210, 320 at the opening. . In some embodiments, one conductive layer provides electromagnetic shielding at the substrate that blocks AC signals carried by contact pads 320C made from another conductive layer on the backside of the substrate. The conductive layer can also be used to form a condenser / rectifier network. Also provided is a manufacturing method. |