abstract |
The present invention is to improve the temperature resistance cycle characteristics after chip mounting and the moisture resistance of the chip-mounted semiconductor, and is used as the adhesive member 3 used when the semiconductor chip 6 is mounted on the organic support substrate 4. An adhesive having a storage modulus of 10 to 2000 MPa and 3 to 50 MPa, respectively, measured at a dynamic visco-elasticity measuring instrument and having a storage modulus of 10 to 2000 MPa and 3 to 50 MPa, respectively. A chip mounting substrate and a method of manufacturing the same are provided. |