patent/KR-100488126-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100488126-B1

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filingDate	2002-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2005-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2005-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-100488126-B1
titleOfInvention	Semiconductor device and manufacturing method thereof
abstract	A semiconductor device comprising: a first electrode formed on a substrate, a concave under bump metal film on the first electrode, and a concave shape of the under bump metal film, and a side surface and a bottom surface of the semiconductor device are embedded by the under bump metal film. An enclosed bump electrode.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101021821-B1
priorityDate	2001-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18476134 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448108619

Total number of triples: 101.