http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100486874-B1

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76889
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-482
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 1998-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2005-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100486874-B1
titleOfInvention Bit line formation method of semiconductor device
abstract 1. TECHNICAL FIELD OF THE INVENTIONn n n The present invention relates to a method for forming a bit line of a semiconductor device.n n n 2. Technical problem to be solved by the inventionn n n When forming a bit line having a structure of titanium / titanium nitride / tungsten / anti-reflective film, the plug polysilicon and the titanium under the bit line react to form titanium silicide (TiSi 2 ), and the titanium silicide ( When TiSi 2 ) is excessively aggregated, the contact resistance is increased to solve the problem of deteriorating the electrical characteristics of the device.n n n 3. Summary of the Solution of the Inventionn n n Titanium is deposited and annealed after forming the bit line to form a titanium silicide (TiSi 2 ) to have a uniform distribution on the top of the plug polysilicon to be used as a diffusion barrier layer between the polysilicon and the titanium film. back) After removing unreacted titanium (Ti), barrier layer is formed and bit line is formed.
priorityDate 1998-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-960002682-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0215620-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04290425-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559362
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453343233
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419520437
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419545355
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23964
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID93091
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23963
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16212546
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6336889
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419516414
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425762086
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559477
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID123185
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3035372

Total number of triples: 33.