http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100483895-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate | 2002-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2005-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100483895-B1 |
| titleOfInvention | Photosensitive resin composition for dry-film photoresist |
| abstract | The present invention relates to a dry film photoresist composition containing a base polymer, a photopolymerization initiator, a photopolymerization monomer and other additives, and using a compound having a structure represented by the following Formula 1 as a photopolymerization monomer in an amount of 1.0 to 30% by weight of the total photosensitive resin composition This provides a dry film photoresist that is excellent in fine wire adhesion and resolution, and exhibits an improved effect after circuit development than conventional resists.n n n n n n n n n n In the above formula, X 1 is a hydrogen atom or a methyl group, Y 1 is a hydrogen atom or a methyl group, n is an integer of 1 to 10, m is an integer of 1 to 10, provided that n + m is an integer of 2 to 20. |
| priorityDate | 2002-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 186.