| abstract |
The present invention provides a resin composition for use in a resistor, a phosphor, a conductor, a pattern, etc., and a cured product thereof. The resin composition can be developed with water or a dilute aqueous alkaline solution, exhibits excellent pattern accuracy, And has excellent adhesion. (A) a resin composition comprising (A) an epoxy resin having two or more epoxy groups per molecule, (b) a compound having one unsaturated double bond and one carboxyl group per molecule, and (c) (B) an epoxy methacrylate obtained by reacting an epoxy (meth) acrylate obtained by reacting a carboxylic acid with a polybasic acid anhydride (d) if necessary, (C) a photopolymerization initiator and D) consists of one or more substances selected from metal powders, metal oxides, metal sulfides or glass. |