| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-28 |
| filingDate |
1997-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100467400-B1 |
| titleOfInvention |
Abrasive Construction for Semiconductor Wafer Modification |
| abstract |
Disclosed is a polishing structure for modifying the surface of a workpiece such as a semiconductor wafer. The abrasive structure comprises a three dimensional textured stationary abrasive element; At least one resilient element overlying the same space as the fixed abrasive element; And at least one rigid element that is generally coplanar with and interposed therebetween with the resilient element and the fixed abrasive element, wherein the rigid element has a Young's modulus greater than the resilient element. |
| priorityDate |
1996-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |