http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100462709-B1

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-305
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-36
filingDate 1996-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2005-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100462709-B1
titleOfInvention Electrical and electronic components made of a polyamide composition
abstract The present invention relates to an electrical component and an electronic component which are improved in resistance under soldering conditions, especially when surface mounting is used, and are made of a polyamide composition.n n n This is obtained using a polyamide composition having a main chain originally composed of aliphatic dicarboxylic acids and units derived from diamines or α, ω-amino acids, wherein 1-40% of the chain units are 1,6-cyclohexanedicarboxylic acids. And derived from aliphatic diamine or derived from 1,4-cyclohexanediamine and aliphatic dicarboxylic acid,n n n As a result, the temperature at which bubbles are formed during the soldering by the infrared method is 20-30 ° C higher than that of the homopolyamide.
priorityDate 1995-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 48.