| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0773
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1998-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2004-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100452255-B1 |
| titleOfInvention |
Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board |
| abstract |
An object of the present invention is to provide an adhesive for electroless plating which is advantageous in securing the insulation reliability between the solder layers by maintaining a practically acceptable strength of the solder and a printed wiring board which is made of an uncured heat resistant resin matrix which is hardly soluble in an acid or an oxidant by a hardening treatment Wherein the heat-resistant resin particles have an average particle diameter of not more than 1.5 mu m, and an adhesive for electroless plating, wherein the heat-resistant resin particles have an average particle diameter of not more than 1.5 mu m, Is provided. |
| priorityDate |
1997-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |