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filingDate 2001-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100450986-B1
titleOfInvention Slurry for chemical mechanical polishing
abstract When using the polishing slurry containing at least abrasive abrasives, oxidizing agents and higher-mono-primary amines to form embedded wirings of copper-based metals on the barrier metal films of tantalum-based metals, It is possible to suppress dishing and erosion that may occur during chemical mechanical polishing (CMP).
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