http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100438641-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2093 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-02 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 |
| filingDate | 1996-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100438641-B1 |
| titleOfInvention | Resin composition for metal deposition without electricity and metal deposition method without electricity |
| abstract | The present invention relates to a polymer (A) having at least one chemical structure selected from the group (a) listed below:n n n (a) a chemical structure in which part of the hydrogen in the main chain of the polymer is substituted with a halogen group or a nitrile group and has a double bond at one position between the aromatic substituents in the main chain of the polymer; Andn n n One or more compounds selected from compounds (b) 1 and (b) 2 listed below:n n n (b) a polymer (B) having a functional group capable of forming a metal salt; Andn n n (b) a low-molecular-weight compound (C) containing a functional group capable of forming a bimetallic salt, which is completely mixed with the polymer (A)n n n To a metal-immersed resin composition which does not use electricity.n n n The present invention also relates to a polymer (A) having at least one chemical structure selected from the group consisting of (a) listed below:n n n (a) a chemical structure having a chemical structure in which part of the hydrogen in the main chain of the polymer is substituted with a halogen group or a nitrile group, and a double bond at a position between the aromatic substituents in the main chain of the polymer; Andn n n One or more compounds selected from group (b) 1 and (b) 2 listed below):n n n (b) a polymer (B) having a functional group capable of forming a metal salt; Andn n n (b) a low-molecular-weight compound (C) having a functional group capable of forming a bimetallic salt, which is thoroughly mixed with the polymer (A)n n n A coating of a metal-immersed resin composition that does not use an electrical current is formed on the surface of a non-conductive body to be plated;n n n Applying a negative constant voltage to the film coating of the resin composition at a temperature not lower than the glass transition point of the resin composition;n n n And then removing the voltage at a temperature below the glass transition temperature; Andn n n And subsequently carrying out the metal deposition step including the step of charging and activating the catalyst. |
| priorityDate | 1995-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.