http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100436050-B1

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B99-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-60
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108
filingDate 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2004-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100436050-B1
titleOfInvention Method of fabricating capacitor
abstract The present invention is to provide a method for manufacturing a capacitor that can improve the electrical properties by minimizing the interface defect between the lower electrode and the dielectric film due to the inclusion of impurities such as a polymer during electrochemical deposition, the present invention for Forming a capacitor lower electrode by using electrochemical deposition; Wet cleaning to remove impurities from the lower electrode surface; Forming a dielectric layer on the lower electrode; And it provides a capacitor manufacturing method comprising the step of forming an upper electrode on the dielectric layer.n n n In addition, the present invention comprises the steps of forming a seed layer on the substrate; Forming a capacitor sacrificial layer on the seed layer; Selectively etching the capacitor sacrificial layer to expose a portion of the seed layer; Forming a lower electrode on the exposed seed layer by the electrochemical deposition; Removing the sacrificial layer; Etching the seed layer exposed by removing the sacrificial layer; Wet cleaning to remove impurities on the lower electrode surface and etching residues of the seed layer; Forming a dielectric layer on the lower electrode; And it provides a capacitor manufacturing method comprising the step of forming an upper electrode on the dielectric layer.
priorityDate 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-950030397-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000042479-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19990087012-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419545355
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419490720
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID46936193
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16212546
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6336889
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419520437

Total number of triples: 25.