http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100435607-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0773 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 1997-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100435607-B1 |
| titleOfInvention | Interlayer adhesive film for multilayer printed wiring board, multilayer printed wiring board comprising the same, and method for manufacturing the wiring board |
| abstract | The present invention relates to an interlayer adhesive film for a multilayer printed wiring board adhered to an innerlayer circuit board, wherein the film is buried and bonded to an innerlayer circuit.n n n In order to manufacture an adhesive film with high productivity, a multilayer printed wiring board in which a conductor circuit layer and an insulating layer are alternately stacked is laminated to form an inner layer circuit pattern and resin filling into through holes and / or surface light oil holes Can be performed at the same time.n n n The present invention also relates to an adhesive film for a multilayer printed wiring board in which a patterned support substrate film and a resin composition that is solid at ambient temperature are laminated on an inner layer circuit board and a method for manufacturing a multilayer printed wiring board using the film will be. Here, the resin composition which is solid at ambient temperature contains 10 wt% or more of a resin having a softening point lower than the temperature of the laminate, and the thickness is thicker than the conductor thickness in the inner layer circuit, Is equal to or greater than the thickness of the conductor in the circuit, or the depth of the surface-light-hole when the surface-light-hole exists in the inner-layer circuit, or at least 1/2 the depth of the through- hole in the inner- |
| priorityDate | 1996-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.