http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100431439-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-308
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
filingDate 2001-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2004-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100431439-B1
titleOfInvention Composition of epoxy resin
abstract The present invention relates to an epoxy resin composition, and relates to an epoxy resin composition for a flame retardant copper foil laminated plate used in a printed circuit board (PCB), and a flame retardant copper foil laminated plate using the same.n n n To this end, the present invention, in the epoxy resin composition for flame-retardant copper-clad laminate, i) a brominated epoxy resin comprising at least two epoxy functional groups; Ii) a multifunctional epoxy resin comprising at least three epoxy functional groups; Iii) imidazole series curing catalysts; And iii) a curing retardant.n n n The present invention uses a brominated epoxy resin having excellent electrical properties and a polyfunctional epoxy resin having a hydrophobic double-cyclic hydrocarbon group having a low electron polarization, and has a low dielectric constant and high heat resistance, as well as high multilayering, high signal speed, and An epoxy composition suitable for high frequency and a flame retardant copper clad laminate using the same as an impregnating resin can be provided.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100697256-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101163334-B1
priorityDate 2001-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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