| abstract |
In the stacked package of the present invention in which a plurality of tape carriers encapsulating a semiconductor chip are stacked in a vertical direction, one end of a lead formed on one surface of the tape carrier is electrically connected to a connection terminal of the semiconductor chip, and the other end of the lead A connection terminal electrically connected to a through hole formed in the tape carrier, the connection terminal common to the plurality of semiconductor chips being formed at the same place of the plurality of tape carriers, and having the same outside through a plurality of through holes that meet each other. It is drawn out to the connection terminal. |