http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100430748-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 1996-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100430748-B1 |
| titleOfInvention | Epoxy resin composition |
| abstract | Epoxy resin suitable for sealing a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a phosphate ester compound (D), wherein the content of the inorganic filler (C) is 80% by weight or more with respect to the composition. Composition.n n n According to the said structure, the epoxy resin composition for semiconductor sealing excellent in flame retardancy, moldability, reliability, and solder heat resistance is obtained, without necessarily using a halogen type flame retardant and an antimony flame retardant. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101478690-B1 |
| priorityDate | 1995-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 90.