| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having solder balls as external connection terminals, and more particularly, to a ball grid array (BGA) semiconductor device for improving the reliability of a solder joint and a method of manufacturing the same. That is, by forming one large cavity inside the solder ball structure, the reliability of the solder ball connection in the BGA semiconductor device can be improved. According to the invention the soldering means and the second volume electrically and mechanically connect the first metal contact pad of the first planar element to the second metal contact pad of the second planar element, the curved outer surface having the first volume. A solder structure is provided comprising an inner cavity having a. The present invention also provides a method of manufacturing a hollow solder structure for electrically and mechanically connecting a first metal contact of a first planar element to a second metal contact of a second planar element, the method of manufacture being a) annular Etching the first metal contact with the land pattern, b) etching the second metal contact with the circular land pattern, c) arranging the soldering means in contact with the annular land pattern, d) the first Positioning a second planar element having a second metal contact in parallel with the planar element in contact with the soldering means, e) applying heat to change the soldering means into a molten state, f) the molten solder is first and Maintaining a temperature for a predetermined time to reflow on the second metal contact surface, and g) removing heat to return the soldering means to a solid state. |