Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B29-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B3-60 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B29-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D7-12 |
filingDate |
1996-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2004-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2004-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-100422603-B1 |
titleOfInvention |
Abrasive pad and manufacturing method thereof |
abstract |
A pad is provided in a polishing apparatus for a silicon wafer, which can use optical detection of the surface state of the wafer when the silicon wafer is polished. This is accomplished by forming all or part of the pad with a hard, uniform polymer sheet that is transparent to the light beam used to detect wafer surface conditions by optical methods, without the intrinsic ability to absorb or transport slurry particles. Polymers that are transparent to light having a wavelength in the range of 190 to 3500 nanometers are suitable for the formation of such pads. |
priorityDate |
1995-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |