http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100417126-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11614 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11622 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2001-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100417126-B1 |
| titleOfInvention | Fabrication method of interconnection bump with high density and high aspect ratio |
| abstract | The present invention relates to a method of forming a bump, which is a connection terminal of a flip chip type semiconductor device, comprising: forming a protective film on a semiconductor chip on which an input / output pad is formed; Exposing a surface of the substrate, forming a metal base layer on the protective film including the exposed input / output pads, forming a plating layer on the metal base layer by using a plating method, applying a photoresist film on the plating layer, and optionally Patterning to form a photoresist pattern, sequentially etching the plating layer and the metal base layer using the photoresist pattern as an etching mask, and applying heat to the plating layer to form bumps of the plating layer on the metal base layer. Steps. |
| priorityDate | 2001-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.