http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100414709-B1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
filingDate 1994-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2004-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100414709-B1
titleOfInvention Heat sink with semiconductor device and manufacturing method of heat sink
abstract The purpose of the present invention is to provide a low-cost, high-quality structure and a manufacturing method for heat sinks used for semiconductor devices with exposed heat sinks. The bonding pads are disposed in a space formed by the leads of the lead frame 1. The heat sink of the heat | fever shape of the semiconductor element 3 each connected to the lead by the wire 5, and the outer periphery formed in the magnitude | size which overlaps with the lead, and the semiconductor element 3 directly disposed in the center part is provided. (4a), an insulator (2) disposed on the lead and adhering and fixing the semiconductor element to the heat sink, and a package (6) sealed with a resin leaving a part of the lead and the top surface of the heat sink. A heat sink comprising a heat sink, wherein the insulator (2) covers a part of the lead and is in the form of a tape connected to the inner surface of the heat sink (4) in contact with the outer peripheral end thereof. Greater than 4 is that the top portion 凸 greater than the minimum area of the side surface, has a side surface to a recessed shape.
priorityDate 1993-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 23.