http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100414709-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 |
filingDate | 1994-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2004-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2004-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-100414709-B1 |
titleOfInvention | Heat sink with semiconductor device and manufacturing method of heat sink |
abstract | The purpose of the present invention is to provide a low-cost, high-quality structure and a manufacturing method for heat sinks used for semiconductor devices with exposed heat sinks. The bonding pads are disposed in a space formed by the leads of the lead frame 1. The heat sink of the heat | fever shape of the semiconductor element 3 each connected to the lead by the wire 5, and the outer periphery formed in the magnitude | size which overlaps with the lead, and the semiconductor element 3 directly disposed in the center part is provided. (4a), an insulator (2) disposed on the lead and adhering and fixing the semiconductor element to the heat sink, and a package (6) sealed with a resin leaving a part of the lead and the top surface of the heat sink. A heat sink comprising a heat sink, wherein the insulator (2) covers a part of the lead and is in the form of a tape connected to the inner surface of the heat sink (4) in contact with the outer peripheral end thereof. Greater than 4 is that the top portion 凸 greater than the minimum area of the side surface, has a side surface to a recessed shape. |
priorityDate | 1993-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.