http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100414698-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2323-055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31515 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31518 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1339 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1339 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2000-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100414698-B1 |
| titleOfInvention | Sealing material composition for liquid crystal |
| abstract | The ion conductivity of the aqueous solution obtained by mixing the epoxy resin composition and the pure water is 1 mS / m or less, and the viscosity at 80 to 100 ° C. of the B stage product is 50 to 10000 Pa · s; The linear expansion coefficient of the cured product of the composition is 10 × 10 −5 mm / mm / ° C. or less, and the heat deformation temperature Tg is 100 ° C. or more; The moisture permeability of the cured product is 200 g / m 2 · 24 hours or less at 80 ° C .; Provided is a liquid crystal sealing composition which enables production of a homogeneous high quality liquid crystal display device by exhibiting high adhesion reliability, which is compatible with a liquid crystal display device (cell) produced by a single layer press heating bonding method. |
| priorityDate | 1999-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 248.