| abstract |
A first semiconductor chip is mounted on the printed circuit board and a second semiconductor chip is mounted on the first semiconductor chip. The second semiconductor chip is moved and positioned in a predetermined direction from the center of the first semiconductor chip. This eliminates the need for a relay terminal on the side of the first semiconductor chip in the direction in which the second semiconductor chip is moved and positioned. This reduces the size of the first semiconductor chip by the area to be occupied by the relay terminal, thereby reducing the size of the semiconductor device. |