| abstract |
Methods and apparatuses for testing unpacked semiconductor dies include a plurality of interconnects 12 suitable for establishing a temporary electrical connection to the dies 14 and on the motherboard 1 and the motherboard 1. Include. This interconnect 12 may be formed of a standing substrate 16 and a silicon substrate 20 for contacting the bond pads 22 of the die 14. Alternatively, the interconnect 16 may be formed of a micro bump contact member 16 provided on the insulating film 74. Motherboard 10 allows each die 14 to be individually tested for speed and function and to be burned in parallel by using a burn-in oven. In another embodiment, the test is performed using a motherboard / slave board device, each slave board 82 including an interconnect 12 that can test the dies 14 individually for speed and function. do. Several slave boards 82 may then be installed on the motherboard 10 for burn-in testing using standard burn-in ovens. |