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filingDate 1998-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2003-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2003-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100371877-B1
titleOfInvention Wiring board, wiring board fabrication method, and semiconductor package
abstract The wiring board of the present invention includes a line (1), a shield pattern (2) disposed substantially parallel to the line (1), a line (1) and a shield pattern (2), and an insulating layer. (3) conductor layers (4) arranged so as to face each other, conductor layer (6) arranged so as to face each other via line (1) and shield pattern (2) and insulating layer (5), and conductor layer (4). ) And conductive layers 7a and 7b for connecting the conductor layer 6 to each other. In this example, these conductive pillars 7a and 7b are connected via the shield pattern 2. By adopting such a configuration, the ground potential is supplied to the shield pattern 2, the conductor layers 4 and 6, and the conductive pillars 7a and 7b, so that the electromagnetic field is extended over the surrounding 360 ° along the extension direction of the line 1. Can be shielded.
priorityDate 1997-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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