http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100366304-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2000-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d4d367e50b6ce0b5c4f9552259500c9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b2bb880fe2a4a1df4a3bf34c4383c06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f214d6c84e04059eb80dbc71277d911 |
| publicationDate | 2003-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100366304-B1 |
| titleOfInvention | Composition for chemical mechanical polishing of insulating layer in semiconductor wafer |
| abstract | The present invention relates to a composition for chemical mechanical polishing (hereinafter referred to as CMP) prepared by adding a pyridine-based compound to an abrasive composed mainly of deionized water and a metal oxide, and more specifically,n n n (A) 0.1-50% by weight of a metal oxide,n n n (B) 50-99.9 wt% of deionized water,n n n (C) 0.001-10 parts by weight based on 100 parts by weight of the pyridine compound (A) + (B)n n n It relates to a composition for chemical mechanical polishing of a semiconductor wafer insulating layer comprising a.n n n The composition according to the present invention is useful for use as a semiconductor wafer abrasive because it reduces the occurrence of μ-scratch, which is a surface defect that can occur after polishing. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101178714-B1 |
| priorityDate | 2000-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.