http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100364227-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-00 |
| filingDate | 1997-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac1bafd11494cb6a24f14a75c289387c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64cbb256d9e933cd853cdb12e1e89d3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14b8a9103e80ecd2f3f4104bb343d71c |
| publicationDate | 2003-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100364227-B1 |
| titleOfInvention | Epoxy Resin Compositions for Semiconductor Device Sealing |
| abstract | The present invention relates to an epoxy resin composition for sealing semiconductor elements using a mixture of an ortho novolak epoxy resin and a bifunctional epoxy resin having a naphthalene structure in a weight ratio of 2: 8 to 6: 4. Introducing a suitable mixture of low viscosity epoxy resin and ortho cresol novolak epoxy resin with structure improves curing characteristics, and high filling inorganic filler reduces moisture absorption and thermal expansion coefficient and improves mechanical strength It is to provide an epoxy resin composition for forming a semiconductor device excellent in molding characteristics and reliability by suppressing the generation of voids generated during device molding. |
| priorityDate | 1997-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.