http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100358232-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 |
| filingDate | 1998-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100358232-B1 |
| titleOfInvention | Epoxy Resin Compositions for Semiconductor Device Encapsulation |
| abstract | The present invention relates to an epoxy resin composition for semiconductor element encapsulation, wherein an epoxy resin composition for semiconductor element encapsulation comprising an epoxy resin and a phenol resin represented by the following Formula 1 as a curing agent is molded in comparison with the conventional epoxy resin composition for semiconductor encapsulation. It has excellent properties and excellent crack resistance at the time of packaging, so it is excellent in mass production of packaging and shows high reliability in high-density surface-mount package bags.n n n [Formula 1]n n n n n n n n Wherein n is an integer of 1 to 10, R 1 is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms or a phenyl group, R 2 is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a phenyl group or limonene, and R 3 is methyl , Dicyclopentadiene, xyline or dimethylbiphenyl and when R 1 and R 2 are each hydrogen atoms, R 3 is not methyl. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102238278-B1 |
| priorityDate | 1998-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.