| abstract |
The present invention relates to an anisotropic conductive adhesive having particles dispersed in a thermoplastic base material.n n n The particles are formed by particles 20 finely dispersed below the percalation threshold, which can be intentionally made anisotropic conductive paths 26 by increasing the concentration, whereby the particles are conductive Or by the decomposition, conversion and reduction of the complex at a place where a conductive structure should be produced. (Figure 2) |