http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100341662-B1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
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filingDate 1999-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2002-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2002-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100341662-B1
titleOfInvention Epoxy Resin Compositions and Semiconductor Devices Encapsulated Therewith
abstract An epoxy resin composition comprising an epoxy resin, a novolak-type phenolic resin curing agent, and at least 70 wt% inorganic filler, wherein at least one of the epoxy resin and the novolak-type phenolic resin curing agent provides an average molecular weight distribution Mw / Mn of less than 1.6. It has a molecular weight distribution, and the quantity of binary nucleus is less than 8 weight%, and the total amount of 7 nucleus or more is less than 32 weight%. When the composition is cured at 180 ° C. for 90 seconds to be the primary product with Tg1 and the primary product is postcured at 180 ° C. for 5 hours to become the secondary product with Tg2,n n n n n (Tg2-Tg1) / Tg2 <0.1n n n n n The relationship of the following equation 1 is satisfied.n n n The composition is cured to a fast product, effective formability and a reliable product that does not require postcure.
priorityDate 1998-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 43.