Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-202 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31924 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31913 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-254 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F255-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L53-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-442 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F255-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F255-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L53-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-24 |
filingDate |
1998-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2002-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2002-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-100330207-B1 |
titleOfInvention |
Heat-resistant, lowly dielectric high-molecular material, and films, substrates, electric components and heat-resistant resin moldings produced therefrom |
abstract |
Preferably, a copolymer in which a nonpolar α-olefin-based polymer segment and a vinyl aromatic copolymer segment are chemically bonded to each other to exhibit a multilayer structure in which the dispersed phase formed by one segment is finely dispersed in the continuous phase formed by the other segment. A heat resistant low dielectric polymer material made of a thermoplastic resin is obtained. A polymer material having excellent heat resistance, high strength, and low dielectric constant suitable for high-frequency electrical insulation materials can be realized. |
priorityDate |
1997-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |