http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100325989-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12903 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-565 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D11-38 |
| filingDate | 1998-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2002-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2002-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100325989-B1 |
| titleOfInvention | A process for applying a stabilization layer to at least one side of copper foil, and its applied foil and laminate |
| abstract | The present invention relates to a process for treating copper foil used in a product of a printed circuit board; Its purpose is to use a hydrogen inhibitor, a method of forming a stabilizing layer on at least one side of a copper foil which can reduce the release of hydrogen during the process of the invention and thus improve the properties of the plated foil and the copper foil formed therefrom. And to provide a laminate.n n n The present invention having such an object comprises a method for forming a stabilizing layer on at least one side of a copper foil, comprising contacting at least one side of the copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor; andn n n A stabilizing layer overlying at least one side of a copper foil, said stabilizing layer being formed by a method comprising contacting said surface of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. Copper foil; Andn n n An electrolytic solution comprising an insulating substrate and a copper foil attached to the insulating substrate, wherein the copper foil has a stabilization layer attached to at least one surface, and the stabilization layer comprises zinc ions, chromium ions, and at least one hydrogen inhibitor. The laminate is formed on the surface of the copper foil by a method including contacting the surface of the copper foil. |
| priorityDate | 1997-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.