http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100316987-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-44 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-30 |
| filingDate | 1998-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2002-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2002-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100316987-B1 |
| titleOfInvention | Composition and method for stripping solder and tin from printed circuit boards |
| abstract | A composition and method are described for removing tin and solder and a lower tin-copper alloy from a copper substrate of a printed circuit board. The liquid of the composition is an amount of an aqueous solution of nitric acid sufficient to dissolve the solder and tin, a source of iron ions sufficient to dissolve the tin-copper alloy, and an amount sufficient to significantly improve the resistance between the printed circuit boards. A source of halide ions. |
| priorityDate | 1997-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.