http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100314836-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-06 |
| filingDate | 1994-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100314836-B1 |
| titleOfInvention | Epoxy Resin Composition |
| abstract | <Purpose> An epoxy resin composition which is used as a laminate of an electronic circuit board and exhibits excellent workability as well as a low dielectric constant and a low dielectric loss coefficient after curing is prepared. <Configuration> (A) Phenolic compound represented by the general formula (I) An epoxy resin composition containing at least one selected from the group consisting of a novolak resin prepared by condensation of formalin and (B) an epoxy resin prepared by glycidylating boric resin with epihalohydrin. In formula, R <1> is a C4-C12 alkyl group and n is an integer of 1-5. |
| priorityDate | 1993-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 111.