| abstract |
A plurality of free standing spring elements 512 are mounted to the surface 510a of the carrier substrate 510. The carrier substrate 510 is mounted to the surface 502a of the semiconductor device 502. The bond pad 504 of the semiconductor device is connected to the spring element 512 by a bond wire 520 extending between the bond pad 504 and the terminal 516 associated with the spring element. Alternatively, the carrier is a flip-chip soldered back to the semiconductor device. The carrier substrate 510 is suitably mounted to one or more semiconductor devices 532, 534 before the semiconductor device is unified from the semiconductor wafer on which the semiconductor device is formed. Elasticity for making a pressurized connection to the semiconductor device 502 is provided by a spring element 512 extending from the carrier substrate 510 itself. Therefore, the carrier substrate 510 maintains moderate rigidity with respect to the semiconductor device 502. Advantageously, the carrier substrate 510 is prefabricated by mounting the spring element 512 to the carrier substrate before mounting the carrier substrate to the semiconductor device. |