http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100297684-B1

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filingDate 1998-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67153b2319a1cce5fdc43090de471bf2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_348e1f9f5c0f0e577b3eccb3258e9511
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publicationDate 2001-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100297684-B1
titleOfInvention Photoresist composition material
abstract OBJECT: The present invention provides a photosensitive resin composition containing an N-hydroxymethyl acrylamide polymer or copolymer which is stable in an acid and does not gel even when mixed with a diazo photosensitive agent, and a method for producing the same.n n n Composition: N-hydroxymethyl acrylamide or N-hydroxymethyl acrylamide and dimethyl acrylamide were added to the pure water together with an initiator, dissolved and warmed in a nitrogen atmosphere to react the polymer of N-hydroxymethyl acrylamide or dimethyl acrylamide. A copolymer with is obtained, and a diazo photosensitive agent is added to the polymer or copolymer and stirred and dissolved in pure water to obtain a photosensitive resin composition for phosphor slurry.n n n Effect: Since N-methylacrylamide polymer or copolymer with dimethyl acrylamide of the present invention has acid resistance, it can be mixed with non-chromic diazo photosensitizer without changing physical properties, thereby improving the sensitivity of the phosphor slurry and soil during disposal. Does not cause heavy metal contamination.
priorityDate 1998-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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