| abstract |
The present invention relates to a semiconductor device improved in functionality by improving a mounting effective area ratio and a method of manufacturing the same.n n n An IC or the like is connected to the semiconductor chip 60 formed on the surface and the plurality of electrodes thereof, is disposed adjacent to the periphery and spaced apart from the semiconductor chip 60 by a predetermined interval, and formed on a substrate separate from the semiconductor chip. A plurality of block-type external connection electrodes 70 and the semiconductor chip 60 and the external connection electrode 70 are disposed to face each other, and each electrode of the semiconductor chip 60 and the external connection electrode 70 are disposed. The wiring board 110 to which the wiring pattern 81 electrically connects, the wiring pattern 81, the electrode of the semiconductor chip 60, and the external connection electrode 70 are connected, and the wiring board 110 is connected. ) And connecting means (90, 100) provided so that a predetermined space is formed between the semiconductor chip (60) and the semiconductor chip (60). |