| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device having a protruding electrode and a semiconductor device, wherein the positioning of the semiconductor device to which the semiconductor device is mounted (for example, an IC socket, a mounting board, etc.) with high accuracy Shall be.n n n The present invention provides a process of manufacturing the positioning substrate 6 by collectively forming the recesses 3 and the positioning holes 4 formed at the position where the solder bumps 2 are formed, and in the recesses 3. The process of loading the solder paste 9, the process of forming the composite board 14 which integrated the circuit board 10 and the positioning board 6, and the position of the positioning board 6 with respect to the cavity 21 In the mold 18 having the second positioning portions 22 and 23 for positioning, the composite substrate 14 is mounted such that the positioning holes 4 engage with the second positioning portions 22 and 23. And the step of forming the sealing resin 5 by filling the cavity 21 with resin, and removing the positioning substrate 6. |