| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-22 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09C1-3009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09C3-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09C1-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09C3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 |
| filingDate |
1997-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72fdfee2132be0f840ac00c8064a1805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20a918c0bcca860b78e9c38eff62d2cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f291c61abc99200579e9bda36cb4bd7f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2fafd00923e7be90b6477384f877df2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1c574f00b75f7d784717973ee9fce70 |
| publicationDate |
2000-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100255340-B1 |
| titleOfInvention |
Inorganic filler, epoxy resin composition, and semiconductor device |
| abstract |
From the starting inorganic filler particles having an average particle diameter of 10-50 μm, the fine particle fraction having a particle size of less than 2 μm was removed and particles having an average particle diameter of 0.1-2 μm and a specific surface area of 3-10 m 2 / g (BET) were added thereto. A granular inorganic filler having an average particle diameter of 5-40 µm is obtained. When a large amount of inorganic filler is loaded into the epoxy resin composition, the composition maintains a low melt viscosity sufficient to form and be effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. Encapsulated semiconductor devices are highly reliable. |
| priorityDate |
1996-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |