http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100250421-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4b2837b6aa88412f5dca22ea366055c http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9a68a7a80d9ec3476c02da5caad4e255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_11aabe36eb77a8c0c52b7da029b7f697 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-3842 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-62 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-62 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-62 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-68 |
| filingDate | 1997-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2000-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79774a2e11b726ac11095a9f5b71b43e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6efb395fcbecabd7d381a66cb29dcb31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24e6139660546aa855f68e65fbf1fe72 |
| publicationDate | 2000-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100250421-B1 |
| titleOfInvention | Method for improving mold release property using low temperature plasma process |
| abstract | 1. TECHNICAL FIELD OF THE INVENTIONn n n The present invention relates to a method for securing release property between a mold and a plastic molding, and more particularly, to a method of increasing mold release property by coating a polymer thin film on a mold surface by a low temperature plasma polymerization process.n n n 2. Technical problem to be solved by inventionn n n Generally, the release agent added to the resin composition so that the molding does not adhere to the mold causes various problems. Accordingly, an object of the present invention is to provide a method for manufacturing a mold capable of molding a resin composition containing no or less release agent by coating a polymer thin film by plasma polymerization on a mold surface to lower the critical surface tension of the mold. will be.n n n 3. Summary of Solution to Inventionn n n The mold surface is pretreated with a plasma of reactive gas, and then the polymer produced by plasma polymerizing the polymerizable gas is deposited on the mold surface and coated.n n n 4. Important uses of the inventionn n n The mold thus produced is used for molding a resin composition containing no mold release agent or containing a usual amount of use. |
| priorityDate | 1996-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.